Method of forming strained structures of semiconductor devices

ABSTRACT

A method of fabricating a semiconductor device comprises providing a substrate with a shallow trench isolation (STI) within the substrate and a gate stack. A cavity is formed between the gate stack and the STI. The cavity comprises one sidewall formed by the STI, one sidewall formed by the substrate, and a bottom surface formed by the substrate. A film is grown in the cavity and thereafter an opening formed by removing a first portion of the strained film until exposing the bottom surface of the substrate while a second portion of the strained film adjoins the STI sidewall. Another epitaxial layer is then grown in the opening.

PRIORITY DATA

The present application is a Divisional Application of U.S. patentapplication Ser. No. 13/296,723, filed Nov. 15, 2011, issuing as U.S.Pat. No. 9,246,004, entitled “STRAINED STRUCTURES OF SEMICONDUCTORDEVICES”, of which is hereby incorporated by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to integrated circuit fabrication and, moreparticularly, to a semiconductor device with a strained structure.

BACKGROUND

As the semiconductor industry has progressed into nanometer technologyprocess nodes in pursuit of higher device density, higher performance,and lower costs, challenges from both fabrication and design issues haveresulted in the development of three-dimensional designs of asemiconductor device, such as a fin field effect transistor (FinFET). Atypical FinFET is fabricated with a thin vertical “fin” (or finstructure) extending from a substrate formed by, for example, etchingaway a portion of a silicon layer of the substrate. The channel of theFinFET is formed in this vertical fin. A gate is provided over threesides (e.g., wrapping) the fin. Having a gate on both sides of thechannel allows gate control of the channel from both sides. Furtheradvantages of FinFETs comprise reducing the short channel effect andhigher current flow.

However, there are challenges to implementation of such features andprocesses in complementary metal-oxide-semiconductor (CMOS) fabrication.For example, non-uniform distribution of strained materials causesnon-uniformity of strains applied to the channel region of thesemiconductor device, thereby increasing the likelihood of deviceinstability and/or device failure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the dimensions of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a flowchart illustrating a method of fabricating asemiconductor device according to various aspects of the presentdisclosure;

FIGS. 2 and 3A-6A show schematic cross-sectional views of asemiconductor device comprising a strained structure at various stagesof fabrication according to various aspects of the present disclosure;and

FIGS. 3B-6B show schematic cross-sectional views of a semiconductordevice comprising a strained structure at various stages of fabricationaccording to various aspects of the present disclosure.

DESCRIPTION

It is understood that the following disclosure provides many differentembodiments, or examples, for implementing different features of theinvention. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Forexample, the formation of a first feature over or on a second feature inthe description that follows may include embodiments in which the firstand second features are formed in direct contact, and may also includeembodiments in which additional features may be formed between the firstand second features, such that the first and second features may not bein direct contact. In addition, the present disclosure may repeatreference numerals and/or letters in the various examples. Thisrepetition is for the purpose of simplicity and clarity and does not initself dictate a relationship between the various embodiments and/orconfigurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. For example, if the device in the figures is turned over,elements described as being “below” or “beneath” other elements orfeatures would then be oriented “above” the other elements or features.Thus, the exemplary term “below” can encompass both an orientation ofabove and below. The apparatus may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein may likewise be interpreted accordingly.

Referring to FIG. 1, illustrated is a flowchart of a method 100 offabricating a semiconductor device according to various aspects of thepresent disclosure. The method 100 begins with step 102 in which asubstrate comprising a major surface is provided. The method 100continues with step 104 in which a shallow trench isolation (STI) isformed within the substrate. The method 100 continues with step 106 inwhich a gate stack is formed on the major surface of the substrate,wherein the STI is disposed on one side of the gate stack. The method100 continues with step 108 in which a cavity is formed distributedbetween the gate stack and the STI, wherein the cavity comprises onesidewall formed by the STI, one sidewall formed by the substrate, and abottom surface formed by the substrate. The method 100 continues withstep 110 in which a strained film is epitaxially grown in the cavity.The method 100 continues with step 112 in which an opening is formed byremoving a first portion of the strained film until exposing the bottomsurface of the substrate, wherein a second portion of the strained filmadjoins the STI sidewall. The method 100 continues with step 114 inwhich a SiGe layer is epi-grown in the opening. The discussion thatfollows illustrates embodiments of semiconductor devices that can befabricated according to the method 100 of FIG. 1.

FIGS. 2 and 3A-6A show schematic cross-sectional views of asemiconductor device 200 comprising a strained structure at variousstages of fabrication according to various aspect of the presentdisclosure. FIGS. 3B-6B show schematic cross-sectional views of asemiconductor device 300 comprising a strained structure at variousstages of fabrication according to various aspect of the presentdisclosure. As employed in the present disclosure, the termsemiconductor devices 200, 300 refer to a fin field effect transistor(FinFET). The FinFET refers to any fin-based, multi-gate transistor.Alternatively, the term semiconductor devices 200, 300 refer to a planarfield effect transistor (FET). The semiconductor devices 200, 300 may beincluded in a microprocessor, memory cell, and/or other integratedcircuit (IC). It is noted that the method of FIG. 1 does not producecompleted semiconductor devices 200, 300. Completed semiconductordevices 200, 300 may be fabricated using complementarymetal-oxide-semiconductor (CMOS) technology processing. Accordingly, itis understood that additional processes may be provided before, during,and after the method 100 of FIG. 1, and that some other processes mayonly be briefly described herein. Also, FIGS. 1 through 6B aresimplified for a better understanding of the concepts of the presentdisclosure. For example, although the figures illustrate thesemiconductor devices 200, 300, it is understood the IC may comprise anumber of other devices comprising resistors, capacitors, inductors,fuses, etc.

Referring to FIG. 2, a substrate 20 comprising a major surface 20 s isprovided. In one embodiment, the substrate 20 comprises a crystallinesilicon substrate (e.g., wafer). The substrate 20 may comprise variousdoped regions depending on design requirements (e.g., p-type substrateor n-type substrate). In some embodiments, the doped regions may bedoped with p-type or n-type dopants. For example, the doped regions maybe doped with p-type dopants, such as boron or BF₂; n-type dopants, suchas phosphorus or arsenic; and/or combinations thereof. The doped regionsmay be configured for an n-type FinFET, or alternatively configured fora p-type FinFET.

The substrate 20 may alternatively be made of some other suitableelementary semiconductor, such as diamond or germanium; a suitablecompound semiconductor, such as gallium arsenide, silicon carbide,indium arsenide, or indium phosphide; or a suitable alloy semiconductor,such as silicon germanium carbide, gallium arsenic phosphide, or galliumindium phosphide. Further, the substrate 20 may include an epitaxiallayer (epi-layer), may be strained for performance enhancement, and/ormay include a silicon-on-insulator (SOI) structure.

In the depicted embodiment, the substrate 20 further comprises a finstructure 202. The fin structure 202, formed on the substrate 20,comprises one or more fins. In the present embodiment, for simplicity,the fin structure 202 comprises a single fin. The fin comprises anysuitable material, for example, the fin may comprise silicon, germaniumor compound semiconductor. The fin structure 202 may further comprise acapping layer disposed on the fin, which may be a silicon-capping layer.

The fin structure 202 is formed using any suitable process comprisingvarious deposition, photolithography, and/or etching processes. Anexemplary photolithography process may include forming a photoresistlayer (resist) overlying the substrate 20 (e.g., on a silicon layer),exposing the resist to a pattern, performing a post-exposure bakeprocess, and developing the resist to form a masking element includingthe resist. The silicon layer may then be etched using reactive ionetching (RIE) processes and/or other suitable processes. In an example,silicon fins of the fin structure 202 may be formed using patterning andetching a portion of the silicon substrate 20. In another example,silicon fins of the fin structure 202 may be formed using patterning andetching a silicon layer deposited overlying an insulator layer (forexample, an upper silicon layer of a silicon-insulator-silicon stack ofan SOI substrate).

In the depicted embodiment, isolation regions are formed within thesubstrate 20 to define and electrically isolate the various fins of thefin structure 202. In one example, the isolation regions include shallowtrench isolation (STI) regions 204. The isolation regions may comprisesilicon oxide, silicon nitride, silicon oxynitride, fluoride-dopedsilicate glass (FSG), a low-K dielectric material, and/or combinationsthereof. The isolation regions, and in the present embodiment, the STI204, may be formed by any suitable process. As one example, theformation of the STI 204 may include filling trenches between the fins(for example, using a chemical vapor deposition process) with adielectric material. In some embodiments, the filled trench may have amulti-layer structure such as a thermal oxide liner layer filled withsilicon nitride or silicon oxide.

Still referring to FIG. 2, a gate stack 210 is formed on the majorsurface 20 s of the substrate 20 (i.e., a top surface of the finstructure 202), wherein the STI 204 is disposed on one side of the gatestack 210. Further, a dummy gate stack 220 may be optionally formed overthe STI 204. In the depicted embodiment, the gate stack 210 and thedummy gate stack 220 comprise a gate dielectric layer 212 and a gateelectrode layer 214. The gate stack 210 and the dummy gate stack 220 maybe formed using any suitable process, including the processes describedherein.

In one example, the gate dielectric layer 212 and gate electrode layer214 are sequentially deposited on the substrate 20. In some embodiments,the gate dielectric layer 212 may include silicon oxide, siliconnitride, silicon oxynitride, or high-k dielectric. High-k dielectricscomprise metal oxides. Examples of metal oxides used for high-kdielectrics include oxides of Li, Be, Mg, Ca, Sr, Sc, Y, Zr, Hf, Al, La,Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and mixtures thereof.In the present embodiment, the gate dielectric layer 212 is a high-kdielectric layer with a thickness in the range of about 10 to 30angstroms. The gate dielectric layer 212 may be formed using a suitableprocess such as atomic layer deposition (ALD), chemical vapor deposition(CVD), physical vapor deposition (PVD), thermal oxidation, UV-ozoneoxidation, or combinations thereof. The gate dielectric layer 212 mayfurther comprise an interfacial layer (not shown) to reduce damagebetween the gate dielectric layer 212 and the fin structure 202. Theinterfacial layer may comprise silicon oxide.

In some embodiments, the gate electrode layer 214 may comprise a singlelayer or multilayer structure. In the present embodiment, the gateelectrode layer 214 may comprise poly-silicon. Further, the gateelectrode layer 214 may be doped poly-silicon with the uniform ornon-uniform doping. Alternatively, the gate electrode layer 214 mayinclude a metal such as Al, Cu, W, Ti, Ta, TiN, TiAl, TiAlN, TaN, NiSi,CoSi, other conductive materials with a work function compatible withthe substrate material, or combinations thereof. In the presentembodiment, the gate electrode layer 214 comprises a thickness in therange of about 30 nm to about 60 nm. The gate electrode layer 214 may beformed using a suitable process such as ALD, CVD, PVD, plating, orcombinations thereof.

Then, a layer of photoresist is formed over the gate electrode layer 214by a suitable process, such as spin-on coating, and patterned to form apatterned photoresist feature by a proper lithography patterning method.In one embodiment, a width of the patterned photoresist feature is inthe range of about 15 to 45 nm. The patterned photoresist feature canthen be transferred using a dry etching process to the underlying layers(i.e., the gate electrode layer 214 and the gate dielectric layer 212)to form the gate stack 210 and the dummy gate stack 220. The photoresistlayer may be stripped thereafter.

In another example, a hard mask layer 216 is formed over the gateelectrode layer 214; a patterned photoresist layer is formed on the hardmask layer 216; the pattern of the photoresist layer is transferred tothe hard mask layer 216 and then transferred to the gate electrode layer214 and the gate dielectric layer 212 to form the gate stack 210 and thedummy gate stack 220. The hard mask layer 216 comprises silicon oxide.Alternatively, the hard mask layer 216 may optionally comprise siliconnitride, silicon oxynitride, and/or other suitable dielectric materials,and may be formed using a method such as CVD or PVD. The hard mask layer216 comprises a thickness in the range from about 100 to 800 angstroms.

Still referring to FIG. 2, the semiconductor device 200 furthercomprises a dielectric layer formed over the gate stack 210 and thedummy gate stack 220. The dielectric layer may include silicon oxide,silicon nitride, silicon oxynitride, or other suitable material. Thedielectric layer may comprise a single layer or multilayer structure.The dielectric layer may be formed by CVD, PVD, ALD, or other suitabletechnique. The dielectric layer comprises a thickness ranging from about5 to 15 nm. Then, an anisotropic etching is performed on the dielectriclayer to form a pair of sidewall spacers 218 on two sides of the gatestack 210 and a pair of sidewall spacers 228 on two sides of the dummygate stack 220.

Referring to FIG. 3A, portions of the fin structure 202 (other thanwhere the gate stack 210 and spacers 218 are formed thereover) arerecessed to form source and drain (S/D) cavities 222 below the majorsurface 20 s of the substrate 20. In the depicted embodiment, eachcavity 222 is distributed between the gate stack 210 and the STI 204,wherein the cavity 222 comprises one sidewall 222 c formed by the STI204, one sidewall 222 a formed by the substrate 20, and a bottom surface222 b formed by the substrate 20.

In the depicted embodiment, using the pair of spacers 218 as hard masks,a biased etching process is performed to recess the major surface 20 sof the substrate 20 that are unprotected or exposed to form the S/Dcavities 222. In one embodiment, the etching process may be performedunder a pressure of about 1 mTorr to 1000 mTorr, at a power of about 50W to 1000 W, with a bias voltage of about 20 V to 500 V, at atemperature of about 40° C. to 60° C., using a HBr and/or Cl₂ as etchgases. Also, in the embodiments provided, the bias voltage used in theetching process may be tuned to allow better control of an etchingdirection to achieve desired profiles for the S/D cavities 222.

In an exemplary embodiment, height H of the S/D cavities 222 may bebetween about 20 nm and about 70 nm, while width W of the S/D cavities222 may be between about 50 nm and about 100 nm. In the depictedembodiment, the aspect ratio (H/W) of the S/D cavities 222 is thusbetween about 0.2 and about 1.4. One skilled in the art will realize,however, that the dimensions and values recited throughout thedescriptions are merely examples, and may be changed to suit differentscales of ICs.

The process steps up to this point have provided the cavities 222distributed between the gate stack 210 and the STI 204. Using alow-pressure chemical vapor deposition (LPCVD) process, a strainedmaterial such as a silicon germanium (SiGe) layer is selectively grownin the cavities 222 along the sidewall 222 a of the substrate 20 and thebottom surface 222 b of the substrate 20, but not along the sidewall 222c of the STI 204. This creates a non-uniform distribution of strainedmaterials in the cavities 222. Since the lattice constant of thestrained material is different from the substrate 20, the channel regionof a semiconductor device is strained or stressed to enhance carriermobility of the device. However, the non-uniform distribution ofstrained materials in the cavities 222 causes non-uniformity of strainsapplied to the channel region of the semiconductor device. Thus, thestrained material may not deliver a given amount of strain into channelregion of the semiconductor device if one sidewall of the strainedmaterial is formed on the STI with an amorphous material such as siliconoxide, resulting in an insufficient on-current of the semiconductordevice.

Accordingly, the processing discussed below with reference to FIGS.4A-6A and 3B-6B may form a cavity filled with a strained structurecomprising a SiGe layer and a strained film on the sidewall of the STI.The strained structure may decrease non-uniform distribution of strainedmaterial such as the SiGe layer, thereby delivering a given amount ofstrain into channel region of the semiconductor device. Problemsassociated with insufficient on-current of a semiconductor device may beavoided, thereby enhancing the device performance.

For fabricating one embodiment of a strained structure 230 (shown inFIG. 6A) of the semiconductor device 200, the structures in FIG. 4A isproduced by epi-growing a strained film 206 in the cavities 222distributed between the gate stack 210 and the STI 204. The strainedfilm 206 thus adjoins the sidewall 222 c of the STI 204, the sidewall222 a of the substrate 20, and the bottom surface 222 b of the substrate20.

In the present embodiments, the strained film 206 may comprise II-VIsemiconductor material or III-V semiconductor material. In someembodiments, the II-VI semiconductor material comprises a materialselected from the group consisting of ZnSe, ZnO, CdTe, and ZnS. In someembodiments, the III-V semiconductor material comprises a materialselected from the group consisting of GaAs, InAs, InGaAs, AlAs, AlGaAs,InP, AlInP, InGaP, GaN, AlGaN, InN, InGaN, InSb, InGaAsSb, InGaAsN, andInGaAsP. In the depicted embodiment, the strained film 206 such asgallium arsenic (GaAs) is epi-grown by a metal-organic chemical vapordeposition (MOCVD) process. The MOCVD process is performed at atemperature of about 400° to 500° C., using trimethylgallium (TMGa) andmonogerman (GeH₄) as reaction gases.

Referring to FIG. 5A, subsequent to the formation of the strained film206 in the cavities 222, an opening 224 is formed by removing a firstportion of the strained film 206 until exposing the bottom surface 222 bof the substrate 20, wherein a second portion 206 a of the strained film206 adjoins the sidewall 222 c of the STI 204 and a third portion 206 bof the strained film 206 adjoins the sidewall 222 a of the substrate 20(i.e., not fully remove the strained film 206 on the sidewall 222 a ofthe substrate 20). The remaining second portion 206 a of the strainedlayer 206 may serve as a strain-keeping layer to help a SiGe layer tostrain or stress the channel region of the semiconductor device 200.

In the depicted embodiment, the opening 224 may be formed by an etchingprocess using a reactive ion etch (RIE) and/or other suitable process.In one example, a hydrofluoric acid (HF) or buffered HF may be used toetch the strained film 206 to expose bottom surface 222 b of thesubstrate 20. In one example, a dry etching process used to etch thestrained film 206 includes a chemistry including fluorine-containinggas. In furtherance of the example, the chemistry of the dry etchincludes CF₄, SF₆, or NF₃.

Referring to FIG. 6A, after the opening 224 is formed by removing afirst portion of the strained film 206 until exposing the bottom surface222 b of the substrate 20, a SiGe layer 208 is epi-grown in the opening224. The SiGe layer 208 thus adjoins the bottom surface 222 b of thesubstrate 20, the second portion 206 a of the strained film 206adjoining the sidewall 222 c of the STI 204, and the third portion 206 bof the strained film 206 adjoining the sidewall 222 a of the substrate20. The SiGe layer 208 may serve as a strained layer to strain or stressthe channel region of the semiconductor device 200.

In some embodiments, a width W₁ of the second portion 206 a of thestrained film 206 is less than a width W₂ of the SiGe layer 208. A ratioof the width W₂ of the SiGe layer 208 to the width W₁ of the secondportion 206 a of the strained film 206 is from 5 to 100. In oneembodiment, a thickness t₁ of the second portion 206 a of the strainedfilm 206 is greater than a thickness t₂ of the SiGe layer 208 (notshown). In another embodiment, a thickness t₁ of the second portion 206a of the strained film 206 is less than a thickness t₂ of the SiGe layer208. A ratio of the thickness t₁ of the second portion 206 a of thestrained film 206 to the thickness t₂ of the SiGe layer 208 is from 0.8to 1.2.

In the present embodiment, the SiGe layer 208 and the second portion 206a of the strained film 206 are combined and referred as a strainedstructure 230. The strained structure 230 may further comprise the thirdportion 206 b of the strained film 206 adjoining the sidewall 222 a ofthe substrate 20. In some embodiments, a width W₃ of the third portion206 b of the strained film 206 is substantially equal to the width W₁ ofthe second portion 206 a of the strained film 206. The strainedstructure 230 may decrease non-uniform distribution of the SiGe layer208, thereby delivering a given amount of strain into channel region ofthe semiconductor device 200, thereby enhancing the device performance.

Alternatively, for fabricating another embodiment of a strainedstructure 330 (shown in FIG. 6B) of the semiconductor device 300, thestructure in FIG. 3B shows the substrate 20 of FIG. 3A after forming arecess 322 in the STI 204 below the sidewall spacer 228 of the dummygate stack 220. The sidewall 222 c of the STI 204 is thus replaced by asidewall 322 c of the STI 204. In the depicted embodiment, a top portionof the STI 204 adjacent to the sidewall spacer 228 of the dummy gatestack 220 may be removed using a wet etching process, for example, bydipping the substrate 20 in a solution comprising HF. Because the wetetching process has higher etch selectivity for oxide than to siliconand silicon nitride, the etch process removes the STI oxide faster thanthe silicon substrate 20 and the silicon nitride sidewall spacer 228.Then, a strained film 306 (shown in FIG. 4B) is epi-grown in the recess322 and the cavity 222. The strained film 306 thus adjoins the sidewall322 c of the STI 204, the sidewall 222 a of the substrate 20, and thebottom surface 222 b of the substrate 20.

In the present embodiments, the strained film 306 may comprise II-VIsemiconductor material or III-V semiconductor material. In someembodiments, the II-VI semiconductor material comprises a materialselected from the group consisting of ZnSe, ZnO, CdTe, and ZnS. In someembodiments, the III-V semiconductor material comprises a materialselected from the group consisting of GaAs, InAs, InGaAs, AlAs, AlGaAs,InP, AlInP, InGaP, GaN, AlGaN, InN, InGaN, InSb, InGaAsSb, InGaAsN, andInGaAsP. In the depicted embodiment, the strained film 306 such asgallium arsenic (GaAs) is epi-grown by a metal-organic chemical vapordeposition (MOCVD) process. The MOCVD process is performed at atemperature of about 400° to 500° C., using trimethylgallium (TMGa) andmonogerman (GeH₄) as reaction gases.

Referring to FIG. 5B, subsequent to the formation of the strained film306 in the recess 322 and cavity 222, an opening 324 is formed byremoving a first portion of the strained film 306 until exposing thebottom surface 222 b of the substrate 20 and the sidewall 222 a of thesubstrate 20 (i.e., simultaneously removes the strained film 306 on thesidewall 222 a of the substrate 20), wherein a second portion 306 a ofthe strained film 306 adjoins the sidewall 322 c of the STI 204. Inother words, at least a portion of the second portion 306 a of thestrained film 306 is below the sidewall spacer 228 of the dummy gatestack 220 over the STI 204. The remaining second portion 306 a of thestrained layer 306 may serve as a strain-keeping layer to help a SiGelayer to strain or stress the channel region of the semiconductor device300.

In the depicted embodiment, the opening 324 may be formed by an etchingprocess using a reactive ion etch (RIE) and/or other suitable process.In one example, a hydrofluoric acid (HF) or buffered HF may be used toetch the strained film 306 to expose bottom surface 222 b of thesubstrate 20 and the sidewall 222 a of the substrate 20. In one example,a dry etching process used to etch the strained film 306 includes achemistry including fluorine-containing gas. In furtherance of theexample, the chemistry of the dry etch includes CF₄, SF₆, or NF₃.

Referring to FIG. 6B, after the opening 324 is formed by removing afirst portion of the strained film 306 until exposing the bottom surface222 b of the substrate 20 and the sidewall 222 a of the substrate 20, aSiGe layer 308 is epi-grown in the opening 324. The SiGe layer 308 thusadjoins the bottom surface 222 b of the substrate 20, the sidewall 222 aof the substrate 20, and the second portion 306 a of the strained film306 adjoining the sidewall 322 c of the STI 204. The SiGe layer 308 mayserve as a strained layer to strain or stress the channel region of thesemiconductor device 300.

In the present embodiment, the SiGe layer 308 and the second portion 306a of the strained film 306 are combined and referred as a strainedstructure 330. The strained structure 330 may further comprise the thirdportion (not shown) of the strained film 306 adjoining the sidewall 222a of the substrate 20. In some embodiments, a width of the third portionof the strained film 306 is less than a width of the second portion 306a of the strained film 306. The strained structure 330 may decreasenon-uniform distribution of the SiGe layer 308, thereby delivering agiven amount of strain into channel region of the semiconductor device300, thereby enhancing the device performance.

After the steps shown in FIGS. 1-6B have been performed, subsequentprocesses, comprising silicidation and interconnect processing, aretypically performed to complete the semiconductor device 200, 300fabrication.

In accordance with embodiments, a semiconductor device comprises asubstrate comprising a major surface; a gate stack on the major surfaceof the substrate; a shallow trench isolation (STI) disposed on one sideof the gate stack, wherein the STI is within the substrate; and a cavityfilled with a strained structure distributed between the gate stack andthe STI, wherein the cavity comprises one sidewall formed by the STI,one sidewall formed by the substrate, and a bottom surface formed by thesubstrate, wherein the strained structure comprises a SiGe layer and afirst strained film adjoining the sidewall of the STI.

In accordance with other embodiments, a method of fabricating asemiconductor device comprises providing a substrate comprising a majorsurface; forming a shallow trench isolation (STI) within the substrate;forming a gate stack on the major surface of the substrate, wherein theSTI is disposed on one side of the gate stack; forming a cavitydistributed between the gate stack and the STI, wherein the cavitycomprises one sidewall formed by the STI, one sidewall formed by thesubstrate, and a bottom surface formed by the substrate; epi-growing astrained film in the cavity; forming an opening by removing a firstportion of the strained film until exposing the bottom surface of thesubstrate, wherein a second portion of the strained film adjoins the STIsidewall; and epi-growing a SiGe layer in the opening.

While the disclosure has been described by way of example and in termsof the preferred embodiments, it is to be understood that the disclosureis not limited to the described embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed:
 1. A method of fabricating a semiconductor device,comprising: providing a substrate comprising a major surface; forming ashallow trench isolation (STI) within the substrate; forming a firstgate stack on the major surface of the substrate and a second gate stackover the STI, wherein the STI is disposed on one side of the first gatestack, and wherein a sidewall spacer abuts the second gate stack;forming a cavity distributed between the first and second gate stacks,wherein the cavity comprises one sidewall defined by the STI, onesidewall defined by the substrate, and a bottom surface defined by thesubstrate; epitaxially growing a strained film in the cavity; forming anopening by removing a first portion of the strained film until exposingthe bottom surface of the substrate, wherein a second portion of thestrained film adjoins the STI sidewall and directly underlies thesidewall spacer of the second gate stack; and epitaxially growing a SiGelayer in the opening.
 2. The method of claim 1, wherein the step offorming the cavity forms a recess in the STI by a wet etching process.3. The method of claim 2, wherein the wet etching process is performedin a solution comprising HF.
 4. The method of claim 1, wherein the stepof forming the opening removes the strained film on the sidewall of thesubstrate.
 5. The method of claim 1, wherein the step of forming theopening does not fully remove the strained film on the sidewall of thesubstrate.
 6. The method of claim 1, wherein the forming the cavitydistributed between the first and second gate stacks includes aligningthe sidewall formed by the STI with the sidewall spacer abutting thesecond gate stack.
 7. The method of claim 1, wherein the providing themajor surface provides a top surface of a fin structure of thesubstrate.
 8. The method of claim 1, wherein the forming the STI definesa fin structure on the substrate; and wherein the forming the first gatestack provides forming the first gate stack on at least at least onsurface of the fin structure.
 9. The method of claim 8, wherein theforming the cavity includes forming the cavity in the fin structure. 10.The method of claim 1, wherein the forming the cavity includes etchingthe substrate and etching the STI.
 11. The method of claim 1, whereinthe forming the cavity includes using spacers abutting the first gatestack as a hard mask during the forming the cavity.
 12. The method ofclaim 1, wherein the epitaxially growing the strained film in the cavityincludes epitaxially growing at least one of a II-VI semiconductormaterial and a III-V semiconductor material.
 13. The method of claim 1,wherein the epitaxially growing the strained material includes growingat least one of ZnSe, ZnO, CdTe, ZnS, GaAs, InAs, InGaAs, AlAs, AlGaAs,InP, AlInP, InGaP, GaN, AlGaN, InN, InGaN, InSb, InGaAsSb, InGaAsN, andInGaAsP.
 14. The method of claim 1, wherein the epitaxially growing thestrained material includes growing at least one of ZnSe, ZnO, CdTe, andZnS.
 15. A method of fabricating a semiconductor device, comprising:forming a shallow trench isolation (STI) within a semiconductorsubstrate; forming a gate stack over the semiconductor substrate;forming a cavity in the semiconductor substrate between the gate stackand the STI, wherein the forming the cavity includes removing a portionof the STI to form a recessed sidewall of the STI; growing an epitaxialfilm such that the epitaxial film is disposed on a sidewall of thecavity adjacent the STI; etching the epitaxial film to expose a bottomsurface of the cavity defined by the semiconductor substrate, whereinafter the etching the epitaxial film abuts the recessed sidewall of theSTI and wherein the etching the epitaxial film includes removing theepitaxial film from a sidewall of the cavity adjacent the gate stack;and epitaxially growing a semiconductor layer in the opening from thebottom surface of the cavity.
 16. The method of claim 15, wherein theforming the cavity is performed by a wet etching process.
 17. The methodof claim 15, wherein the growing the epitaxial film includes growing atleast one of a II-VI semiconductor material and a III-V semiconductormaterial.
 18. The method of claim 17, wherein the growing the epitaxialfilm is performed by a metal-organic chemical vapor deposition (MOCVD)process.
 19. The method of claim 15, wherein the etching the epitaxialfilm is performed by a reactive ion etch (RIE).